Generation of inter-metallic compounds from the copper in the land and solder alloy tin is minimized, thus achieving higher reliability.
Increased wettability and decreased voiding means improved solderability.
Patents in Japan and other major countries means safer supply to you.
Products | LLS 219β | LLS 219 |
---|---|---|
Specific gravity | 7.38 | 7.38 |
Tensile strength(MPa) | 40.8 | 39.7 |
Elongation(%) | 70 | 74 |
Hardness(Hv) | 14.5 | 13.8 |
Coefficient of linear expansion (*10-6/K) | 23.5 | 20.8 |
(2000 cycle)
-40°*30min⇔125°*30min (per cycle)
Wettability
Occurrence of voids X-ray observations