SOLDER COAT CO.,LTD.
General commercial product / Lead-free solder paste MT LF219
A high versatility solder paste that possesses outstanding continuous printability and prevents the occurrence of electromigration.
| Viscosity(Pa·s) | 180-220 |
|---|---|
| Thixotropic Index | 0.55-0.65 |
| Halogen content(%) | <0.05 |
| Insulation resistance(Ω) | >1.0*109 |
| Copper corrosion test | Pass |
Comparison of continuous print
Condition of electromigration occurrence
Test condition: 85°, 85RH%, 1000h
Applied voltage: 16V; Voltage during measurement: 100V
