A solder paste featuring improved viscosity and corrosiveness at a low cost.
Viscosity(Pa·s) | 180-220 |
---|---|
Thixotropic Index | 0.55-0.65 |
Halogen content(%) | <0.05 |
Insulation resistance(Ω) | >1.0*109 |
Copper corrosion test | Pass |
Atmosphere: Air, Peak temp.: 250°