SOLDER COAT CO.,LTD.
Halogen-free / Lead-free solder paste XFP LF 219
A solder paste that realizes outstanding solderability while also reducing flux splash to the lowest possible amount.
| Viscosity(Pa·s) | 180-220 |
|---|---|
| Thixotropic Index | 0.55-0.65 |
| Halogen content(%) | Lower limit ofdetection*1 |
| Insulation resistance(Ω) | >1.0*108 |
| Copper corrosion test | Pass |
*1 Combustion - Ion Chromatography
Comparison of flux splash
Comparison of soldering characteristic (wettabillity)
